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RF and Microwave Microelectronics Packaging II 1st ed. 2017 edition
RF and Microwave Microelectronics Packaging II
It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.
172 pages, 50 black & white illustrations, 77 colour illustrations, 130 colour tables, biography
| Médium | Knihy Hardcover Book (Kniha s pevnou väzbou a obalom) |
| Vydané | 22. marca 2017 |
| ISBN13 | 9783319516967 |
| Vydavatelia | Springer International Publishing AG |
| Strany | 172 |
| Rozmery | 155 × 235 × 13 mm · 439 g |
| Jazyk | Francúzština |
| Editor | Kuang, Ken |
| Editor | Sturdivant, Rick |