Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes - E Zschech - Knihy - Springer London Ltd - 9781852339418 - 01. septembra 2005
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Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes 2005 edition

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This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.


508 pages, 72 black & white tables, biography

Médium Knihy     Hardcover Book   (Kniha s pevnou väzbou a obalom)
Vydané 01. septembra 2005
ISBN13 9781852339418
Vydavatelia Springer London Ltd
Strany 508
Rozmery 155 × 235 × 28 mm   ·   916 g
Jazyk Angličtina  
Editor Mikolajick, Thomas
Editor Whelan, Caroline
Editor Zschech, Ehrenfried

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