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IC Interconnect Analysis Mustafa Celik Softcover reprint of the original 1st ed. 2002 edition
IC Interconnect Analysis
Mustafa Celik
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components.
320 pages, biography
| Médium | Knihy Paperback Book (Kniha s mäkkou väzbou a lepeným chrbtom) |
| Vydané | 23. marca 2013 |
| ISBN13 | 9781475776744 |
| Vydavatelia | Springer-Verlag New York Inc. |
| Strany | 310 |
| Rozmery | 155 × 235 × 17 mm · 453 g |
| Jazyk | Angličtina |