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Advanced MEMS Packaging
John Lau
This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging.
576 pages, Illustrations
| Médium | Knihy Hardcover Book (Kniha s pevnou väzbou a obalom) |
| Vydané | 16. decembra 2009 |
| ISBN13 | 9780071626231 |
| Vydavatelia | McGraw-Hill Education - Europe |
| Strany | 576 |
| Rozmery | 161 × 237 × 36 mm · 906 g |