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3D IC Integration and Packaging John Lau Ed edition
3D IC Integration and Packaging
John Lau
A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications
512 pages
| Médium | Knihy Hardcover Book (Kniha s pevnou väzbou a obalom) |
| Vydané | 16. októbra 2015 |
| ISBN13 | 9780071848060 |
| Vydavatelia | McGraw-Hill Education - Europe |
| Strany | 480 |
| Rozmery | 196 × 245 × 28 mm · 1,03 kg |
| Jazyk | Angličtina |