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3D Microelectronic Packaging: From Architectures to Applications - Springer Series in Advanced Microelectronics Second Edition 2021 edition
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3D Microelectronic Packaging: From Architectures to Applications - Springer Series in Advanced Microelectronics
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.
622 pages, 100 Tables, color; 205 Illustrations, color; 94 Illustrations, black and white; XVII, 622
| Médium | Knihy Paperback Book (Kniha s mäkkou väzbou a lepeným chrbtom) |
| Vydané | 24. novembra 2021 |
| ISBN13 | 9789811570926 |
| Vydavatelia | Springer Verlag, Singapore |
| Strany | 622 |
| Rozmery | 150 × 220 × 10 mm · 967 g |
| Editor | Goyal, Deepak |
| Editor | Li, Yan |
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