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Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering Cheng 2020 edition
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Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering
Cheng
Co-authored by an international research group with a long-standing cooperation, this book focuses on engineering-oriented electromagnetic and thermal field modeling and application.
685 pages, 110 Tables, color; 232 Illustrations, color; 391 Illustrations, black and white; XXX, 685
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | December 16, 2019 |
| ISBN13 | 9789811501722 |
| Publishers | Springer Verlag, Singapore |
| Pages | 685 |
| Dimensions | 150 × 220 × 20 mm · 1.17 kg |
| Editor | Cheng, Zhiguang |
| Editor | Forghani, Behzad |
| Editor | Takahashi, Norio |
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