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Materials for Advanced Packaging Softcover reprint of the original 2nd ed. 2017 edition
Materials for Advanced Packaging
Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.
969 pages, 434 Tables, color; 85 Tables, black and white; 440 Illustrations, color; 260 Illustration
| Médium | Knihy Paperback Book (Kniha s mäkkou väzbou a lepeným chrbtom) |
| Vydané | 08. júna 2018 |
| ISBN13 | 9783319832098 |
| Vydavatelia | Springer International Publishing AG |
| Strany | 969 |
| Rozmery | 234 × 157 × 55 mm · 1,49 kg |
| Jazyk | Nemčina |
| Editor | Lu, Daniel |
| Editor | Wong, C.P. |