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Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications Softcover reprint of the original 1st ed. 2015 edition
Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.
408 pages, 35 Tables, black and white; 269 Illustrations, color; 191 Illustrations, black and white;
| Médium | Knihy Paperback Book (Kniha s mäkkou väzbou a lepeným chrbtom) |
| Vydané | 28. marca 2019 |
| ISBN13 | 9783319792552 |
| Vydavatelia | Springer International Publishing AG |
| Strany | 408 |
| Rozmery | 150 × 220 × 10 mm · 645 g |
| Jazyk | Nemčina |
| Editor | Kada, Morihiro |
| Editor | Kondo, Kazuo |
| Editor | Takahashi, Kenji |