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3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization Lennart Bamberg 2022 edition
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3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization
Lennart Bamberg
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
395 pages, 100 Illustrations, color; 2 Illustrations, black and white; XXV, 395 p. 102 illus., 100 i
| Médium | Knihy Paperback Book (Kniha s mäkkou väzbou a lepeným chrbtom) |
| Vydané | 29. júna 2023 |
| ISBN13 | 9783030982317 |
| Vydavatelia | Springer Nature Switzerland AG |
| Strany | 395 |
| Rozmery | 150 × 220 × 10 mm · 589 g |
| Jazyk | Nemčina |
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