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Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes Ehrenfried Zschech Softcover reprint of hardcover 1st ed. 2005 edition
Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes
Ehrenfried Zschech
This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.
508 pages, 72 black & white tables, biography
| Médium | Knihy Paperback Book (Kniha s mäkkou väzbou a lepeným chrbtom) |
| Vydané | 22. októbra 2010 |
| ISBN13 | 9781849969673 |
| Vydavatelia | Springer London Ltd |
| Strany | 508 |
| Rozmery | 155 × 235 × 27 mm · 734 g |
| Jazyk | Angličtina |
| Editor | Mikolajick, Thomas |
| Editor | Whelan, Caroline |
| Editor | Zschech, Ehrenfried |