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Thermal Stress and Strain in Microelectronics Packaging John Lau Softcover reprint of the original 1st ed. 1993 edition
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Thermal Stress and Strain in Microelectronics Packaging
John Lau
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications.
884 pages, 466 black & white illustrations
| Médium | Knihy Paperback Book (Kniha s mäkkou väzbou a lepeným chrbtom) |
| Vydané | 30. apríla 2012 |
| ISBN13 | 9781468477696 |
| Vydavatelia | Springer-Verlag New York Inc. |
| Strany | 884 |
| Rozmery | 152 × 229 × 45 mm · 1,19 kg |
| Jazyk | Angličtina |
| Editor | Lau, John |
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