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Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development Way Kuo Softcover Reprint of the Original 1st Ed. 1998 edition
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Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development
Way Kuo
420 pages, biography
| Médium | Knihy Paperback Book (Kniha s mäkkou väzbou a lepeným chrbtom) |
| Vydané | 14. marca 2014 |
| ISBN13 | 9781461375968 |
| Vydavatelia | Springer-Verlag New York Inc. |
| Strany | 420 |
| Rozmery | 155 × 235 × 22 mm · 589 g |
| Jazyk | Angličtina |
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