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Materials for Advanced Semiconductor Packaging and Heterogeneous Integration
Materials for Advanced Semiconductor Packaging and Heterogeneous Integration
This book offers a comprehensive review of the key topics and the latest advancements in innovative materials for advanced semiconductor packaging and heterogeneous integration.
| Médium | Knihy Hardcover Book (Kniha s pevnou väzbou a obalom) |
| Na vydanie | 20. októbra 2026 |
| ISBN13 | 9781032959436 |
| Vydavatelia | Taylor & Francis Ltd |
| Strany | 472 |
| Rozmery | 150 × 220 × 20 mm · 453 g |
| Editor | Shangguan, Dongkai |