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Hybrid Assemblies and Multichip Modules - Manufacturing Engineering and Materials Processing Kear 1. vydanie
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Hybrid Assemblies and Multichip Modules - Manufacturing Engineering and Materials Processing
Kear
Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.
296 pages, 1, black & white illustrations
| Médium | Knihy Hardcover Book (Kniha s pevnou väzbou a obalom) |
| Vydané | 16. decembra 1992 |
| ISBN13 | 9780824784669 |
| Vydavatelia | Taylor & Francis Inc |
| Strany | 296 |
| Rozmery | 156 × 234 × 17 mm · 635 g |
| Jazyk | Angličtina |
