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Manufacturing Challenges in Electronic Packaging 1998 edition
Lee
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Manufacturing Challenges in Electronic Packaging 1998 edition
Lee
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements.
261 pages, biography
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | December 31, 1997 |
| ISBN13 | 9780412620300 |
| Publishers | Chapman and Hall |
| Pages | 261 |
| Dimensions | 155 × 235 × 17 mm · 562 g |
| Editor | Chen, W.T. |
| Editor | Lee, Y.C. |
