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3D IC Stacking Technology Banqiu Wu Ed edition
3D IC Stacking Technology
Banqiu Wu
The latest advances in three-dimensional integrated circuit stacking technology
544 pages, illustrations
| Médium | Knihy Hardcover Book (Kniha s pevnou väzbou a obalom) |
| Vydané | 16. septembra 2011 |
| ISBN13 | 9780071741958 |
| Vydavatelia | McGraw-Hill Education - Europe |
| Strany | 544 |
| Rozmery | 237 × 159 × 36 mm · 936 g |
| Jazyk | Angličtina |