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Die Attach Materials for High Temperature Applications in Microelectronics Packa 1st ed. 2019 edition
Die Attach Materials for High Temperature Applications in Microelectronics Packa
276 pages, 100 Tables, color; 121 Illustrations, color; 54 Illustrations, black and white; XX, 276 p
| Médium | Knihy Book |
| Vydané | 07. februára 2019 |
| ISBN13 | 9783319992556 |
| Vydavatelia | Springer International Publishing AG |
| Strany | 279 |
| Rozmery | 242 × 167 × 19 mm · 623 g |
| Jazyk | Nemčina |
| Editor | Siow, Kim S. |