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3D Microelectronic Packaging: From Fundamentals to Applications - Springer Series in Advanced Microelectronics Yan Li Softcover reprint of the original 1st ed. 2017 edition
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3D Microelectronic Packaging: From Fundamentals to Applications - Springer Series in Advanced Microelectronics
Yan Li
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.
463 pages, 253 Illustrations, color; 78 Illustrations, black and white; IX, 463 p. 331 illus., 253 i
| Médium | Knihy Paperback Book (Kniha s mäkkou väzbou a lepeným chrbtom) |
| Vydané | 13. júla 2018 |
| ISBN13 | 9783319830865 |
| Vydavatelia | Springer International Publishing AG |
| Strany | 463 |
| Rozmery | 150 × 220 × 10 mm · 662 g |
| Jazyk | Nemčina |
| Editor | Goyal, Deepak |
| Editor | Li, Yan |