Povedzte o tejto položke priateľom:
Direct Copper Interconnection for Advanced Semiconductor Technology
Direct Copper Interconnection for Advanced Semiconductor Technology
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
| Médium | Knihy Paperback Book (Kniha s mäkkou väzbou a lepeným chrbtom) |
| Vydané | 22. mája 2026 |
| ISBN13 | 9781032528403 |
| Vydavatelia | Taylor & Francis Ltd |
| Strany | 448 |
| Rozmery | 150 × 220 × 10 mm · 850 g |
| Editor | Shangguan, Dongkai |